The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 11, 2019

Filed:

Jun. 27, 2017
Applicant:

The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);

Inventor:

Maurice S. Karpman, Brookline, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/31 (2006.01); H01L 23/485 (2006.01); H01L 29/84 (2006.01); H01L 23/00 (2006.01); G01L 19/14 (2006.01); G01L 19/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0061 (2013.01); B81C 1/0023 (2013.01); B81C 1/00309 (2013.01); G01L 19/0069 (2013.01); G01L 19/147 (2013.01); H01L 23/3185 (2013.01); H01L 23/485 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 29/84 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/098 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A one or multi-die module comprises multiple dies. The module includes at least one die with a sensor having a sensing region, an encapsulation layer covering top sides of the multiple dies, and a redistribution layer (RDL) covering bottom sides of the multiple dies except for the sensing region. In embodiments, a cap is formed over the sensing region, which has at least a portion that is spaced away from a bottom side of the module. Metal connectors, such as solder balls, are formed on the redistribution layer to provide connection points to the module. This approach can be used to incorporate environmental sensor dies into multi-die modules. It utilizes RDL and openings in the RDL in order to provide robust packaging for the dies, while also allowing the sensor dies to be selectively exposed to the environment.


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