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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9257355 B1

PDFFull Text
Date of Patent:
Feb. 09, 2016

Filed:

Feb. 11, 2014

Method for embedding a chipset having an intermediary interposer in high density electronic modules

Applicant:

The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);

Inventors:

Brian Smith, Cambridge, MA (US);

Maurice Karpman, Cambridge, MA (US);

Assignee:

The Charles Stark Draper Laboratory, Inc., Cambridge, MA (US);

Attorneys:

Locke Lord LLP

Christopher J. Capelli

Alexander Viderman

Primary Examiner:

Errol Fernandes

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 21/568 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method for creating a high density electronic module including the steps of coupling a die to an interposer for form a chipset, mounting the chipset to a substrate, coupling a wafer to the substrate so that the chipset is within a window formed in the wafer, filling the window with encapsulant to encapsulate the chipset, removing the substrate to create a reconstructed wafer, and providing an interconnection structure on the interposer to form the high density electronic module.

Find Patent Forward Citations

Smith, Brian. (2016). Method for embedding a chipset having an intermediary interposer in high density electronic modules (U.S. Patent No. 9257355). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9257355

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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