The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2007
Filed:
Sep. 28, 2004
Maurice S. Karpman, Brookline, MA (US);
Nicole Hablutzel, Cambridge, MA (US);
Peter W. Farrell, Lunenburg, MA (US);
Michael W. Judy, Wakefield, MA (US);
Lawrence E. Felton, Hopkinton, MA (US);
Lewis Long, Woburn, MA (US);
Maurice S. Karpman, Brookline, MA (US);
Nicole Hablutzel, Cambridge, MA (US);
Peter W. Farrell, Lunenburg, MA (US);
Michael W. Judy, Wakefield, MA (US);
Lawrence E. Felton, Hopkinton, MA (US);
Lewis Long, Woburn, MA (US);
Analog Devices, Inc., Norwood, MA (US);
Abstract
A MEMS inertial sensor is secured within a premolded-type package formed, at least in part, from a low moisture permeable molding material. Consequently, such a motion detector should be capable of being produced more economically than those using ceramic packages. To those ends, the package has at least one wall (having a low moisture permeability) extending from a leadframe to form a cavity, and an isolator (with a top surface) within the cavity. The MEMS inertial sensor has a movable structure suspended above a substrate having a bottom surface. The substrate bottom surface is secured to the isolator top surface at a contact area. In illustrative embodiments, the contact area is less than the surface area of the bottom surface of the substrate. Accordingly, the isolator forms a space between at least a portion of the bottom substrate surface and the package. This space thus is free of the isolator. Moreover, due to the low moisture permeability of the package, further production steps can be avoided while ensuring that moisture does not adversely affect the MEMS inertial sensor within the cavity.