Company Filing History:

14 out of 164,108

International Business Machines Corporation

Years Active: 1998-2017

where 'Filed Patents' based on already Granted Patents

15 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9708508 - Slurry for chemical-mechanical polishing of metals and use thereof (2017-07-18),

2. 9057004 - Slurry for chemical-mechanical polishing of metals and use thereof (2015-06-16),

3. 8806740 - Silicon chicklet pedestal (2014-08-19),

4. 8734665 - Slurry for chemical-mechanical polishing of copper and use thereof (2014-05-27),

5. 8636917 - Solution for forming polishing slurry, polishing slurry and related methods (2014-01-28),

6. 8595919 - Silicon chicklet pedestal (2013-12-03),

7. 8328892 - Solution for forming polishing slurry, polishing slurry and related methods (2012-12-11),

8. 8088690 - CMP method (2012-01-03),

9. 7987591 - Method of forming silicon chicklet pedestal (2011-08-02),

10. 7824568 - Solution for forming polishing slurry, polishing slurry and related methods (2010-11-02),

11. 6355565 - Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers (2002-03-12),

12. 6294105 - Chemical mechanical polishing slurry and method for polishing metal/oxide layers (2001-09-25),

13. 5944583 - Composite polish pad for CMP (1999-08-31),

14. 5885135 - CMP wafer carrier for preferential polishing of a wafer (1999-03-23),

15. 5842910 - Off-center grooved polish pad for CMP (1998-12-01),

Certainly! Here is the article about inventor Matthew T Tiersch:

Title: Innovator Spotlight: Matthew T Tiersch

Introduction:

Matthew T Tiersch, based in Essex Junction, VT (US), is a prolific inventor with an impressive portfolio of 15 patents to his name. His groundbreaking work in the field of chemical-mechanical polishing of metals has garnered him recognition in the industry.

Latest Patents:

His latest patents revolve around the development of a slurry for chemical-mechanical polishing of metals and its application. This composition includes a unique blend of components such as a surfactant anion, an alkyl alcohol, a diluent, abrasive particles, and an oxidizer. The method he has devised involves the precise application and polishing of surfaces to achieve exceptional results.

Career Highlights:

Matthew T Tiersch has made significant contributions to renowned companies like IBM (International Business Machines Corporation) and Globalfoundries Inc.. His innovative work has paved the way for advancements in materials science and surface polishing technologies.

Collaborations:

Throughout his career, Matthew T Tiersch has collaborated with esteemed professionals in the industry, including Eric Jeffrey White and Timothy Charles Krywanczyk. These collaborations have led to the development of cutting-edge solutions and have fueled innovation in the field.

Conclusion:

In conclusion, Matthew T Tiersch stands out as a visionary inventor, whose dedication to advancing the field of chemical-mechanical polishing of metals has resulted in the creation of patented technologies that are shaping the future of the industry. His contributions continue to inspire and drive progress in materials science and surface engineering.

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