The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 1998

Filed:

Mar. 10, 1997
Applicant:
Inventors:

Timothy Charles Krywanczyk, Essex Junction, VT (US);

Douglas Keith Sturtevant, Essex Junction, VT (US);

Matthew Thomas Tiersch, Essex Junction, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 41 ; 451 57 ; 451285 ;
Abstract

A method and apparatus for polishing a semiconductor wafer using a polishing pad. The polishing pad contains circumferential grooves which are located off center from the geometric center of the polishing pad.


Find Patent Forward Citations

Krywanczyk, Timothy. (1998). Off-center grooved polish pad for cmp (U.S. Patent No. 5842910). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5842910

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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