The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2012
Filed:
Mar. 31, 2009
Thomas L. Mcdevitt, Underhill, VT (US);
Graham M. Bates, Waterbury, VT (US);
Eva A. Shah, Essex Junction, VT (US);
Matthew T. Tiersch, Essex Junction, VT (US);
Eric J. White, Charlotte, VT (US);
Thomas L. McDevitt, Underhill, VT (US);
Graham M. Bates, Waterbury, VT (US);
Eva A. Shah, Essex Junction, VT (US);
Matthew T. Tiersch, Essex Junction, VT (US);
Eric J. White, Charlotte, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
The instant invention is a method of polishing a substrate including contacting a substrate having at least one metal layer including copper with a chemical-mechanical polishing composition. The CMP composition includes an abrasive, a surfactant, an oxidizer, an organic acid including polyacrylic acid or polymethacrylic acid, a corrosion inhibitor, and a liquid carrier. A portion of the copper in the metal layer is abraded to polish the substrate. A second CMP composition contacts the abraded substrate, the second acrylate free composition including an abrasive, a surfactant, an oxidizer, and a corrosion inhibitor, and a liquid carrier. Any dendrites that may have formed on the substrate are removed through abrasion.