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For the Inventor, By the Inventor

Livermore, CA, United States of America

Masud Beroz

This inventor holds 77 USPTO granted patents and 4 published patent applications, primarily in Microelectronic Packaging (CPC class H01L). Top assignees: Adeia Semiconductor Bonding Technologies Inc., Componentzee, LLC, Cubic Corporation. Active years: 1999-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masud Beroz. Retrieved from https://idiyas.com/inventor/masud-beroz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 77 

% Patents Active = 76.6

Average Co-Inventor Count = 2.5

ph-index = 25

Forward Citations = 1,825(Granted Patents)

Forward Citations (Not Self Cited) = 1,772(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Milpitas, CA (US) (1999 - 2006)
  • Livermore, CA (US) (2000 - 2012)
  • San Jose, CA (US) (2010 - 2013)
  • Cary, NC (US) (2009 - 2017)
  • Morrisville, NC (US) (2014 - 2019)
  • Apex, NC (US) (2014 - 2020)

Company Filing History:

goldMedal70 out of 1,911 
 
Adeia Semiconductor Bonding Technologies Inc.
 patents
silverMedal3 out of 3 
 
Componentzee, LLC
 patents
bronzeMedal1 out of 348 
 
Cubic Corporation
 patents
4. 3 out of 834,601 
Other
 patents

Years Active: 1999-2020

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Areas of Expertise:
Wafer-Level Packages
Chip-Scale Packages
Fluid Pressure Activation
Quantum Efficiency
Heat Spreading Substrates
Three Dimensional Interposer
Microelectronic Connection Components
High Yield Assembly
Conductive Solder Mask
Stacked Packaging Improvements
Substrate Assembly
Interconnected Redistribution Paths
77 patents (USPTO):Explore Patents
1. 10847469 - CTE compensation for wafer-level and chip-scale packages and assemblies (2020-11-24),
2. 10748858 - High yield substrate assembly (2020-08-18),
3. 10396041 - High yield substrate assembly (2019-08-27),
4. 10128601 - Fluid pressure activated electrical contact devices and methods (2018-11-13),
5. 10003149 - Fluid pressure activated electrical contact devices and methods (2018-06-19),
6. 9947643 - Inverted optical device (2018-04-17),
7. 9842745 - Heat spreading substrate with embedded interconnects (2017-12-12),
8. 9805891 - Multiplexing, switching and testing devices and methods using fluid pressure (2017-10-31),
9. 9583671 - Quantum efficiency of multiple quantum wells (2017-02-28),
10. 9577358 - Fluid pressure activated electrical contact devices and methods (2017-02-21),
11. 9570416 - Stacked packaging improvements (2017-02-14),
12. 9293641 - Inverted optical device (2016-03-22),
13. 9153562 - Stacked packaging improvements (2015-10-06),
14. 8975616 - Quantum efficiency of multiple quantum wells (2015-03-10),
15. 8963013 - Three dimensional interposer device (2015-02-24),

Title: The Innovative Journey of Masud Beroz

Introduction: Masud Beroz, a talented inventor based in Livermore, CA (US), has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Masud Beroz holds several patents in various technological domains, showcasing his versatility and creativity in innovation.

Career Highlights: Throughout his career, Masud Beroz has demonstrated a keen eye for identifying gaps in the market and developing solutions that push the boundaries of what is possible. His innovative spirit has led to the creation of products that have revolutionized industries.

Collaborations: Masud Beroz has collaborated with leading tech companies and research institutions to further his inventions and bring them to market. His ability to work effectively in teams has been instrumental in the success of his projects.

Conclusion: Masud Beroz's passion for innovation and his dedication to creating impactful solutions have solidified his reputation as a pioneering inventor in the tech industry. His continued pursuit of excellence promises a future filled with groundbreaking inventions that will shape the world we live in.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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