The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2018

Filed:

Mar. 21, 2016
Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Ilyas Mohammed, Santa Clara, CA (US);

Masud Beroz, Morrisville, NC (US);

Liang Wang, Milpitas, CA (US);

Assignee:

INVENSAS CORPORATION, San Jose, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/16 (2006.01); H01L 33/06 (2010.01); H01L 33/22 (2010.01); H01L 33/32 (2010.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 33/0079 (2013.01); H01L 33/06 (2013.01); H01L 33/22 (2013.01); H01L 33/32 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/58 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.


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