The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2017
Filed:
Sep. 30, 2015
Applicant:
Tessera, Inc., San Jose, CA (US);
Inventors:
Assignee:
Tessera, Inc., San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/49575 (2013.01); H01L 23/49833 (2013.01); H01L 24/97 (2013.01); H01L 25/105 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/97 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1029 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/01002 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3011 (2013.01);
Abstract
A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substrate. Lead frame is joined to a further substrate with one or more microelectronic elements disposed between the substrates.