The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Jan. 20, 2015
Applicant:
Invensas Corporation, San Jose, CA (US);
Inventors:
Ilyas Mohammed, Santa Clara, CA (US);
Masud Beroz, Apex, NC (US);
Assignee:
Invensas Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 21/52 (2006.01); H01L 21/768 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/486 (2013.01); H01L 21/52 (2013.01); H01L 21/768 (2013.01); H01L 23/142 (2013.01); H01L 23/49568 (2013.01); H01L 24/97 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/19107 (2013.01);
Abstract
Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.