The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Jul. 17, 2019
Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Liang Wang, Newark, CA (US);

Ilyas Mohammed, Santa Clara, CA (US);

Masud Beroz, Apex, NC (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01); H01L 33/00 (2010.01); H01L 27/02 (2006.01); H01L 21/02 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/02035 (2013.01); H01L 21/02378 (2013.01); H01L 21/02381 (2013.01); H01L 21/02389 (2013.01); H01L 21/02392 (2013.01); H01L 21/02395 (2013.01); H01L 21/02414 (2013.01); H01L 21/6835 (2013.01); H01L 23/544 (2013.01); H01L 24/19 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/50 (2013.01); H01L 27/0207 (2013.01); H01L 33/005 (2013.01); H01L 21/02002 (2013.01); H01L 33/0062 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/351 (2013.01);
Abstract

High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.


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