Masahiro Wada

USPTO Granted Patents = 48 (Patent Applications = 5)

CIPO Patents = 2 (Patent Applications = 1)

EPO Patents = 7 (Patent Applications = 4)

Average Co-Inventor Count = 2.3

ph-index = 12

Forward Citations = 476(Granted Patents)

Location History:

Chiba, JP (1994)
Utsunomiya, JP (2011)
Saitama, JP (1991 - 2013)
Kanagawa, JP (1998 - 2016)
Tokyo, JP (1987 - 2022)

Company Filing History:

Kokusai Denshin Denwa Co., Ltd.

patents

7 out of 612

Sumitomo Bakelite Company Limited

patents

4. 3 out of 339

Kokusai Denshin Denwa Kabushiki Kaisha

patents

5. 3 out of 7,524

Renesas Electronics Corporation

Nippon Telegraph and Telephone Corporation

patents

9. 2 out of 67

Yoshino Gypsum Co., Ltd.

Toyo Communication Equipment Co., Ltd.

Sumitomo Bakelight Co., Ltd.

patent

14. 1 out of 2,467

Nec Electronics Corporation

patents

15. 1 out of 21

Kddi R&d Laboratories, Inc.

where one patent can have more than one assignee

Years Active: 1987-2025

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48 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12312809 - Gypsum-based load-bearing board, load-bearing wall structure, and load-bearing wall construction method for wooden construction building (2025-05-27),

2. 11538712 - Suction holder and holding mechanism for ring frame (2022-12-27),

3. 11318625 - Ring frame holding mechanism (2022-05-03),

4. 10943811 - Tape affixing apparatus (2021-03-09),

5. 9368354 - Semiconductor device and method of manufacturing the same (2016-06-14),

6. 8883883 - Resin composition for encapsulating semiconductor and semiconductor device (2014-11-11),

7. 8809478 - Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition (2014-08-19),

8. 8653205 - Resin composition for encapsulating semiconductor and semiconductor device (2014-02-18),

9. 8629556 - Semiconductor device (2014-01-14),

10. 8592994 - Semiconductor package, core layer material, buildup layer material, and sealing resin composition (2013-11-26),

11. 8582366 - Semiconductor device using charge pump circuit (2013-11-12),

12. 8552572 - Resin composition for encapsulating semiconductor and semiconductor device using the same (2013-10-08),

13. 8502399 - Resin composition for encapsulating semiconductor and semiconductor device (2013-08-06),

14. 8410062 - Collagen peptide, dipeptide and malady inhibitor (2013-04-02),

15. 8325533 - Semiconductor device using charge pump circuit (2012-12-04),

Title: Masahiro Wada - Innovative Inventor from Saitama, JP

Introduction: Masahiro Wada is a highly skilled inventor hailing from Saitama, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Masahiro Wada holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Masahiro Wada has worked with leading research institutions and tech companies, consistently pushing the boundaries of what is possible in the realm of innovation.

Collaborations: Throughout his career, Masahiro Wada has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of creativity and excellence in all his projects.

Conclusion: Masahiro Wada's passion for innovation and his relentless pursuit of technological advancement make him a true pioneer in the world of inventors, leaving a lasting impact on the industry for years to come.

This text is generated by artificial intelligence and may not be accurate.