Kddi Corporation

Kokusai Denshin Denwa Co., Ltd.

Sumitomo Bakelite Company Limited

Renesas Electronics Corporation

Disco Corporation

Kokusai Denshin Denwa Kabushiki Kaisha

Nippon Telegraph and Telephone Corporation

Yoshino Gypsum Co., Ltd.

Kdd Corporation

Nitta Gelatin Inc.

Nec Corporation

Nec Electronics Corporation

Adeka Corporation

Toyo Communication Equipment Co., Ltd.

Kddi R&d Laboratories, Inc.

Masahiro Wada

Yasuhiro Takishima

Shigeyuki Sakazawa

Ryoichi Kawada

Shuichi Matsumoto

Atsushi Koike

Osamu Sugimoto

Hirohisa Yamaguchi

Kenya Tachibana

Hideo Yamamoto

Naoki Inoue

Tomoya Hasegawa

Fumihito Sugihara

Hisayuki Kobayashi

Seiko Koizumi

Chinfang Liu

Hajime Takasaki

Hiroshi Mano

Sachie Nakatani

Naohisa Watanabe

Hiroyuki Tanaka

Kensuke Nakamura

Takashi Oyamada

Hitoshi Kawaguchi

Takehito Tsukamoto

Takeshi Hosomi

Hiroshi Yoshimura

Junko Toda

Mitsuo Sugino

Koichi Takagi

Ushio Sudo

Hiroshi Hirose

Takuya Kanazawa

Shoichi Okazaki

Osamu Yoshioka

Masako Saito

Toshiyasu Rikiishi

Wataru Nakamura

Ryota Chiba

Takuya Hatao

Hitomi Murakami

Masataka Arai

Ichiro Hiratsuka

Sei Naitou

Shizuo Taira

Teppei Itoh

Yasuyuki Amagai

Shuuichi Matsumoto

Gouichi Ishihara

Yasutoshi Watanabe

Tetsuji Yamashita

Kazuo Tominaga

Daisuke Naito

Katsumi Tada

Muneyoshi Nagano

Yousuke Sato

Tsuneo Tsuruzawa

The present invention is to provide a gypsum-based load-bearing board for wood structural load-bearing walls which is capable of increasing the co-efficient of effective wall length without additionally using reinforcement materials or stiffening materials, and without increasing the specific gravity and/or the thickness of the gypsum-based load-bearing board. The gypsum-based load-bearing board for wood structural load-bearing walls includes a main member or a core member formed from a board-shaped hardened gypsum containing an inorganic fiber and an organic-based strength enhancer that exert a lateral nail resistance of 500 N or more, and a paper covering at least front and back sides of the main member or the core member to constitute the load-bearing board.

Gypsum-based load-bearing board, load-bearing wall structure, and load-bearing wall construction method for wooden construction building

A suction holder for sucking and holding a holding target member includes a sucker, a tube bellows connected to a lower end of the sucker, and a tube arranged inside the tube bellows and having an upper end positioned lower than an upper end of the sucker. A lower opening of the tube is communicated with a suction source and the holding target member is contacted with the upper end of the sucker to form a closed room, and the inside of the closed room is placed into a negative pressure state to hold the holding target member.

Suction holder and holding mechanism for ring frame

A ring frame holding mechanism holds under suction a lower surface of a ring frame when the ring frame is set at a target position, by using a positioning unit. In positioning the ring frame, air is discharged through a suction cup in a table to thereby form an air layer between the upper surface of the table and the lower surface of the ring frame. This air layer brings the ring frame and the suction cup into a noncontact state and also depresses the suction cup downward so that the upper end of the suction cup becomes flush with the table. Accordingly, the ring frame can be floated over the suction cup, so that the ring frame can be easily moved horizontally. That is, the ring frame can be easily set to the target position and the occurrence of improper positioning can be suppressed.

Ring frame holding mechanism

A tape affixing apparatus includes: a holding unit including a frame holding unit and a wafer holding portion; a feeding unit configured to feed a tape unit; a winding unit configured to wind a sheet from which a dicing tape is peeled off; a plate configured to be brought into contact with the sheet and peel the tape off from the sheet by bending the tape unit with the sheet on the inside; an affixing roller configured to affix the peeled-off tape to a frame and a wafer; and a nozzle configured to blow air so as to make the peeled-off tape conform to the affixing roller.

Tape affixing apparatus

To improve the reliability of a semiconductor device. In particular, the reading of incorrect information from a memory cell is suppressed. A first low-concentration region is formed in a well, and is located under a side wall insulating film in a planar view. The first low-concentration region has a second conductivity type, and the second conductivity-type impurity concentration is lower than the impurity concentration in a drain. A second low-concentration region is formed in the well, and is located under a spacer insulating film in a planar view. In addition, a second conductivity type impurity concentration in the second low-concentration region is lower than the second conductivity-type impurity concentration in the first low-concentration region, and is higher than the second conductivity-type impurity concentration in a portion located under the insulating film of the well.

Semiconductor device and method of manufacturing the same

Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

Resin composition for encapsulating semiconductor and semiconductor device

A curable composition includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of an organosilane mixture including RSiX, RSiX, RRSiXand RSiX, the total of RSiXand RRSiX2 being 5 to 60 mol %, optionally a prepolymer, optionally a cyclic siloxane compound, 0.0001 to 10 parts by mass of an organic peroxide and optionally a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein Ris a C2-6 alkenyl group, Ris a C1-6 alkyl group, Rand Rare each a C1-6 alkyl group, Ris a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group, one or more of Rto Ris a methyl group, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.

Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition

Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C&#x2267;4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

The semiconductor deviceincludes a substrate, a semiconductor chipmounted on the substrate, the substrate, a bumpconnecting the substrateand the semiconductor chip, and an underfillfilling in around the bump. In the case of a bumpcomposed of a high-melting-point solder having a melting point of 230&#xb0; C. or more, the underfillis composed of a resin material having an elastic modulus in the range of 30 MPa to 3000 MPa. In the case of a bumpcomposed of a lead-free solder, the underfillis composed of a resin material having an elastic modulus in the range of 150 MPa to 800 MPa. An insulating layerof buildup layersof the substratehas a linear expansion coefficient of 35 ppm/&#xb0; C. or less in the in-plane direction of the substrate at temperatures in the range of 25&#xb0; C. to the glass transition temperature.

Semiconductor device

A flip-chip semiconductor package includes a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured member that is made of a sealing resin composition and enclosed between the semiconductor device and the circuit board. The coefficient of linear expansion at 25 to 75&#xb0; C. of the cured member is 15 to 35 ppm/&#xb0; C., the glass transition temperature of at least one buildup layer is 170&#xb0; C. or more, and the coefficient of linear expansion of at 25 to 75&#xb0; C. of the at least one buildup layer in the planar direction is 25 ppm or less. A highly reliable flip-chip semiconductor package, buildup layer material, core layer material, and sealing resin composition can be provided by preventing cracks and inhibiting delamination.

Semiconductor package, core layer material, buildup layer material, and sealing resin composition

A semiconductor device including a plurality of capacitance units connected in parallel between a first voltage and a second voltage. Each of the plurality of capacitance units includes: a capacitance element connected with the first voltage; and a capacitance disconnecting circuit connected between the second voltage and the capacitance element. The capacitance disconnecting circuit includes a non-volatile memory cell with a threshold voltage changed based on a change of a leakage current which flows from the capacitance element, and blocks off the leakage current based on a rise of the threshold voltage of the non-volatile memory cell when the leakage current exceeds a predetermined value.

Semiconductor device using charge pump circuit

Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost. The composition includes a phenol resin (A), an epoxy resin (B), and an inorganic filler (C). The phenol resin (A) includes at least one polymer component (A0) composed of a polymer having structural units represented by general formulae (1) and (2), and at least one polymer component (A0) is composed of a polymer having structural units represented by general formulae (1) and (2) and terminated on at least one end with an aromatic group free of polar groups and containing at least one alkyl group having 1 to 3 carbon atoms: wherein R1 and R2 are each independently a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms; each R3 is independently a hydrocarbon group having 1 to 6 carbon atoms; and a is an integer of 0 to 3 , wherein R5, R6, R8 and R9 are each independently a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms; each R4 and R7 is independently a hydrocarbon group having 1 to 6 carbon atoms; b is an integer of 0 to 3; and c is an integer of 0 to 4.

Resin composition for encapsulating semiconductor and semiconductor device using the same

Disclosed is a resin composition for encapsulating a semiconductor containing a curing agent, an epoxy resin (B) and an inorganic filler (C), wherein the curing agent is a phenol resin (A) having a predetermined structure. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.

A problem that the present invention is to solve is to provide: a main body of a peptide molecule which is effective for inhibition of various maladies such as osteoporosis, osteoarthritis and pressure ulcer, particularly, a dipeptide which is easy to absorb into a body in an intestine; a collagen peptide which comprises the dipeptide as an essential dipeptide; and a malady inhibitor which comprises the dipeptide as an essential effective component. As a means of solving such a problem, a collagen peptide according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential dipeptide. A dipeptide according to the present invention is characterized by having a structure of Hyp-Gly. A malady inhibitor according to the present invention is characterized by comprising a dipeptide having a structure of Hyp-Gly as an essential effective component.

Collagen peptide, dipeptide and malady inhibitor

Growing community of inventors

Saitama, Japan

Masahiro Wada