The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
May. 28, 2010
Applicant:
Masahiro Wada, Tokyo, JP;
Inventor:
Masahiro Wada, Tokyo, JP;
Assignee:
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 59/62 (2006.01); C08L 63/00 (2006.01); C08L 61/04 (2006.01); C08K 3/00 (2006.01); H01L 23/29 (2006.01); C08G 59/68 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); C08L 63/00 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15747 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48011 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45015 (2013.01);
Abstract
Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.