The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Jun. 16, 2010
Applicant:
Masahiro Wada, Tokyo, JP;
Inventor:
Masahiro Wada, Tokyo, JP;
Assignee:
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a resin composition for encapsulating a semiconductor containing a curing agent, an epoxy resin (B) and an inorganic filler (C), wherein the curing agent is a phenol resin (A) having a predetermined structure. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.