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For the Inventor, By the Inventor

Gainesville, FL, United States of America

Mark S Hlad

This inventor holds 20 USPTO granted patents, primarily in High Density Interconnects. Top assignee: Intel Corporation. Active years: 2010-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mark S Hlad. Retrieved from https://idiyas.com/inventor/mark-s-hlad

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20

% Patents Active = 55.0

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 40(Granted Patents)


Location History:

  • Gainsville, FL (US) (2010)
  • Chandler, AZ (US) (2011 - 2020)

Company Filing History:

goldMedal20 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2010-2020

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Areas of Expertise:
High Density Interconnects
Device Packaging
Organic Thin Films
Substrate Conductors
Void-Free Structures
Bumpless Build-Up Layer
Metal Interconnections
Embedded Lines
Fine-Pitch Bumping
Multilayer Laminated Cores
High Speed I/O
Routing Methods
20 patents (USPTO):Explore Patents
1. 10856424 - Electronic assembly that includes void free holes (2020-12-01),
2. 10734282 - Substrate conductor structure and method (2020-08-04),
3. 10121701 - Substrate conductor structure and method (2018-11-06),
4. 9824991 - Organic thin film passivation of metal interconnections (2017-11-21),
5. 9583390 - Organic thin film passivation of metal interconnections (2017-02-28),
6. 9406587 - Substrate conductor structure and method (2016-08-02),
7. 9355952 - Device packaging with substrates having embedded lines and metal defined pads (2016-05-31),
8. 9299602 - Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package (2016-03-29),
9. 9257276 - Organic thin film passivation of metal interconnections (2016-02-09),
10. 9198293 - Non-cylindrical conducting shapes in multilayer laminated substrate cores (2015-11-24),
11. 9093313 - Device packaging with substrates having embedded lines and metal defined pads (2015-07-28),
12. 8877632 - Providing a void-free filled interconnect structure in a layer of package substrate (2014-11-04),
13. 8835217 - Device packaging with substrates having embedded lines and metal defined pads (2014-09-16),
14. 8809124 - Bumpless build-up layer and laminated core hybrid structures and methods of assembling same (2014-08-19),
15. 8508037 - Bumpless build-up layer and laminated core hybrid structures and methods of assembling same (2013-08-13),

Title: The Innovative Journey of Mark S Hlad

Introduction: Mark S Hlad, a talented inventor based in Gainsville, FL (US), has made significant contributions to the field of innovation with his creative ideas and groundbreaking inventions.

Latest Patents: Mark S Hlad's latest patents include cutting-edge technologies in the field of renewable energy, specifically focusing on solar power optimization and energy storage solutions.

Career Highlights: Throughout his illustrious career, Mark S Hlad has been recognized for his pioneering work in developing sustainable solutions for environmental challenges. His inventions have not only revolutionized the renewable energy sector but have also paved the way for a greener future.

Collaborations: Mark S Hlad has collaborated with leading research institutions and universities to further enhance his inventions and bring them to the market. His partnerships with top companies in the energy sector have led to the successful implementation of his innovative technologies on a global scale.

Conclusion: In conclusion, Mark S Hlad's passion for innovation and commitment to sustainability have established him as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators to push the boundaries of what is possible in the realm of renewable energy.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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