The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Sep. 25, 2015
Intel Corporation, Santa Clara, CA (US);
Sri Ranga Sai Boyapati, Chandler, AZ (US);
Amanda E. Schuckman, Chandler, AZ (US);
Sashi S. Kandanur, Chandler, AZ (US);
Srinivas Pietambaram, Gilbert, AZ (US);
Mark Hlad, Chandler, AZ (US);
Kristof Darmawikarta, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A method that includes electroplating both sides of a core and the through hole of a core with a conductive material to cover both sides of the core with the conductive material and to form a conductive bridge in the through hole, wherein the core has a thickness greater than 200 microns; etching the conductive material that covers both sides of the core to reduce the thickness of the conductive material to about 1 micron; applying a film resist to the core; exposing and developing the resist film to form patterns on the conductive material on both sides of the core; and electroplating additional conductive material on the (i) conductive material on both sides of the core (ii) conductive material within the through hole; and (iii) conductive bridge to fill the through hole with conductive material without any voids and to form conductive patterns on both sides of the core.