The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Jan. 16, 2013
Harold R. Chase, Mesa, AZ (US);
Mathew J. Manusharow, Phoenix, AZ (US);
Mark S. Hlad, Chandler, AZ (US);
Mihir K. Roy, Chandler, AZ (US);
Harold R. Chase, Mesa, AZ (US);
Mathew J. Manusharow, Phoenix, AZ (US);
Mark S. Hlad, Chandler, AZ (US);
Mihir K. Roy, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Non-cylindrical conducting shapes are described in the context of multilayer laminated substrate cores. In one example a package substrate core includes a plurality of dielectric layers pressed together to form a multilayer core, a conductive bottom pattern on a bottom surface of the multilayer core, and a conductive top pattern on a top surface of the multilayer core. At least one elongated via extends through each layer of the multilayer core, each elongated via containing a conductor and each connected to a conductor of a via in an adjacent layer to electrically connect the top pattern and the bottom pattern through the conductors of the elongated vias.