The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Dec. 20, 2011
Qinglei Zhang, Chandler, AZ (US);
Tao Wu, Chandler, AZ (US);
Mark S. Hlad, Chandler, AZ (US);
Charavana K. Gurumurthy, Chandler, AZ (US);
Qinglei Zhang, Chandler, AZ (US);
Tao Wu, Chandler, AZ (US);
Mark S. Hlad, Chandler, AZ (US);
Charavana K. Gurumurthy, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A bumpless build-up layer (BBUL) integrated circuit package and method of manufacturing are presented. In some embodiments, the package-on-package (PoP) pads of the BBUL integrated circuit package has a surface finish that can be palladium, nickel-palladium, nickel-gold, nickel-palladium-gold, or palladium-nickel-palladium-gold. In some embodiments, the PoP pad surface finish can be formed using either an electroless or electrolytic process.