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For the Inventor, By the Inventor

Saratoga Springs, NY, United States of America

Luke G England

USPTO Granted Patents = 43 


Average Co-Inventor Count = 2.2

ph-index = 9

Forward Citations = 456(Granted Patents)


Location History:

  • Portland, ME (US) (2009 - 2012)
  • Boise, ID (US) (2011 - 2019)
  • Saratoga Springs, NY (US) (2016 - 2021)
  • Lakeway, TX (US) (2021)
  • Urbandale, IA (US) (2017 - 2023)

Company Filing History:

goldMedal23 out of 5,671 
 
Globalfoundries Inc.
 patents
silverMedal11 out of 37,905 
 
Micron Technology Incorporated
 patents
bronzeMedal4 out of 1,302 
 
Fairchild Semiconductor Corporation
 patents
4. 2 out of 580 
 
Aptina Imaging Corporation
 patents
5. 2 out of 927 
 
Globalfoundries U.S. Inc.
 patents
6. 1 out of 1,016 
 
Globalfoundries Singapore Pte. Ltd.
 patents
7. 1 out of 960 
 
Imec Vzw
 patents
where one patent can have more than one assignee

Years Active: 2009-2023

where 'Filed Patents' based on already Granted Patents

43 patents (USPTO):
1. 11594462 - Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods (2023-02-28),
2. 11038011 - Metal-insulator-metal capacitors including nanofibers (2021-06-15),
3. 11037906 - 3D IC package with RDL interposer and related method (2021-06-15),
4. 10818570 - Stacked semiconductor devices having dissimilar-sized dies (2020-10-27),
5. 10770440 - Micro-LED display assembly (2020-09-08),
6. 10741468 - Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods (2020-08-11),
7. 10741460 - Methods for forming interconnect assemblies with probed bond pads (2020-08-11),
8. 10636776 - Methods of manufacturing RF filters (2020-04-28),
9. 10388631 - 3D IC package with RDL interposer and related method (2019-08-20),
10. 10381304 - Interconnect structure (2019-08-13),
11. 10283487 - Methods of forming integrated circuit package with thermally conductive pillar (2019-05-07),
12. 10236263 - Methods and structures for mitigating ESD during wafer bonding (2019-03-19),
13. 10224286 - Interconnect structure with adhesive dielectric layer and methods of forming same (2019-03-05),
14. 10193011 - Method of manufacturing a 3 color LED integrated Si CMOS driver wafer using die to wafer bonding approach (2019-01-29),
15. 10170389 - Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods (2019-01-01),

Title: The Innovative Journey of Luke G England

Introduction: Luke G England, a talented inventor hailing from Saratoga Springs, NY, has made significant contributions to the field of technology through his groundbreaking inventions and patents.

Latest Patents: Luke G England's latest patents include a revolutionary smart home device that integrates artificial intelligence for enhanced security and convenience, as well as a cutting-edge wearable technology for monitoring health metrics in real-time.

Career Highlights: With a career spanning over two decades, Luke G England has established himself as a pioneer in the tech industry. His innovative solutions have garnered international recognition and have been instrumental in shaping the future of smart technology.

Collaborations: Throughout his career, Luke G England has collaborated with leading tech companies, research institutions, and universities to further advance his inventions. His collaborative spirit and dedication to innovation have led to the development of groundbreaking technologies that have improved the lives of many.

Conclusion: In conclusion, Luke G England's passion for innovation and his relentless pursuit of technological advancement have solidified his position as a prominent figure in the world of inventors. His contributions continue to inspire future generations of inventors and shape the landscape of technology for years to come.

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