The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2020
Filed:
May. 16, 2019
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Luke England, Saratoga Springs, NY (US);
Daniel George Berger, New Paltz, NY (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/481 (2013.01); H01L 24/09 (2013.01); H01L 25/0652 (2013.01); H01L 27/0688 (2013.01);
Abstract
A stacked semiconductor device is provided, which includes a first die, a second die and a heat dissipating layer. The first die has a pre-determined size. The second die is bonded to the first die using a dielectric material, wherein the second die is smaller than the first die. The heat dissipating layer is surrounding the second die, wherein the heat dissipating layer has an outer dimension that is equal to the size of the first die.