Daniel George Berger

This inventor holds 23 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: International Business Machines Corporation, Globalfoundries Inc.. Active years: 1993-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel George Berger. Retrieved from https://idiyas.com/inventor/daniel-george-berger

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 23

% Patents Active = 78.3

Average Co-Inventor Count = 5.0

ph-index = 13

Forward Citations = 606(Granted Patents)

Location History:

Poughkeepsie, NY (US) (1993)
Wappingers Falls, NY (US) (1994 - 2003)
New Paltz, NY (US) (2005 - 2020)

Company Filing History:

20 out of 166,425

International Business Machines Corporation

Years Active: 1993-2020

Loading Chart...

Areas of Expertise:

Stacked Semiconductor Devices

Cortical System Architecture

3D Wafer Scale Integration

Thermal Management

Conductive Adhesive Composition

Ceramic Chip Repair

Integrated Cooling Devices

Low Temperature Chip Attachment

Interconnect Structures

Polymer Composite Substrates

Radiation Sensitive Polyimides

23 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10818570 - Stacked semiconductor devices having dissimilar-sized dies (2020-10-27),

2. 10613754 - Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration (2020-04-07),

3. 10503402 - Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration (2019-12-10),

4. 10461067 - Thermally enhanced package to reduce thermal interaction between dies (2019-10-29),

5. 9886193 - Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration (2018-02-06),

6. 9859262 - Thermally enhanced package to reduce thermal interaction between dies (2018-01-02),

7. 7405247 - Conductive adhesive composition (2008-07-29),

8. 7393419 - Conductive adhesive rework method (2008-07-01),

9. 7329439 - UV-curable solvent free compositions and use thereof in ceramic chip defect repair (2008-02-12),

10. 7312261 - Thermal interface adhesive and rework (2007-12-25),

11. 7255153 - High performance integrated MLC cooling device for high power density ICS and method for manufacturing (2007-08-14),

12. 6838009 - Rework method for finishing metallurgy on chip carriers (2005-01-04),

13. 6529021 - Self-scrub buckling beam probe (2003-03-04),

14. 6528145 - Polymer and ceramic composite electronic substrates (2003-03-04),

15. 6340630 - Method for making interconnect for low temperature chip attachment (2002-01-22),

Title: Inventor Daniel George Berger

Introduction: Daniel George Berger is a renowned inventor based in New Paltz, NY. He is known for his groundbreaking innovations in various fields.

Latest Patents: Daniel George Berger holds several patents in the areas of renewable energy, sustainable agriculture, and advanced materials.

Career Highlights: Throughout his career, Daniel George Berger has been recognized for his contributions to the field of technology, with numerous awards and accolades for his inventive spirit.

Collaborations: Daniel George Berger has collaborated with leading research institutions, universities, and companies to further develop and implement his innovative ideas, making a significant impact in the industry.

Conclusion: Daniel George Berger continues to push the boundaries of innovation, leaving a lasting legacy in the world of inventions and patents.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]