The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2005

Filed:

Oct. 30, 2001
Applicants:

Charles L. Arvin, South Bend, IN (US);

Daniel G. Berger, New Paltz, NY (US);

Hsichang Liu, Fishkill, NY (US);

Krystyna W. Semkow, Poughquag, NY (US);

Inventors:

Charles L. Arvin, South Bend, IN (US);

Daniel G. Berger, New Paltz, NY (US);

Hsichang Liu, Fishkill, NY (US);

Krystyna W. Semkow, Poughquag, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1300 ; H01L 2100 ;
U.S. Cl.
CPC ...
Abstract

A method and apparatus are provided for reworking of finishing metallurgy on pads of electronic components. The pads are copper or copper/nickel and have a layer of nickel thereon and an overlying layer of gold. The gold layer is removed first followed by the nickel layer and then the component is treated to remove etch and corrosion products. Media blasting is then used to restore the pads to their original condition as on prime parts. The pads are then replated using conventional nickel and gold plating solutions to form the reworked component.


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