International Business Machines Corporation

Globalfoundries Inc.

Daniel George Berger

Subramanian Srikanteswara Iyer

Peter Alfred Gruber

Krishna Gandhi Sachdev

Carlos Juan Sambucetti

David Hirsch Danovitch

Guy Paul Brouillette

Kelly May Chioujones

Toshiaki Kirihata

Arvind Kumar

Hilton T Toy

James L Speidell

Charles Hampton Perry

Rajesh S Patel

Troy Lawrence Graves-Abe

Glenn Graham Daves

Winfried W Wilcke

Stephen Roux

William Thomas Motsiff

Eric D Perfecto

Lester W Herron

Janak G Patel

James N Humenik

Michael Liehr

Bruce Lee Humphrey

John Ulrich Knickerbocker

Charles Leon Arvin

Marie Angelopoulos

Govindarajan Natarajan

Bruno Michel

Thomas Weiss

Raschid Jose Bezama

Willi Volksen

Kwong Hon Wong

Sudipta Kumar Ray

Krystyna Waleria Semkow

Luke G England

Shaji Farooq

Sally Ann Swanson

Brian W Quinlan

Robert William Pasco

Yuet-Ying Yu

Hsichang Liu

Jeffrey W Labadie

Umar M Ahmad

Scott Ira Langenthal

Keshav B Prasad

Martha Inez Sanchez

Terence W Spoor

Mark R LaForce

Susan J LaMaire

Camille Proietti Bowne

Ananda Kumar

Marie Angelopolus

Peter J Wilkens

A stacked semiconductor device is provided, which includes a first die, a second die and a heat dissipating layer. The first die has a pre-determined size. The second die is bonded to the first die using a dielectric material, wherein the second die is smaller than the first die. The heat dissipating layer is surrounding the second die, wherein the heat dissipating layer has an outer dimension that is equal to the size of the first die.

Stacked semiconductor devices having dissimilar-sized dies

A processor-memory system, a stacked-wafer processor-memory system, and a method of fabricating a processor-memory system are disclosed. In an embodiment, the invention provides a processor-memory system comprising a memory area, a multitude of specialized processors, and a management processor. The specialized processors are embedded in the memory area, and each of the specialized processors is configured for performing a specified set of operations using an associated memory domain in the memory area. The management processor is provided to control operations of an associated set of the specialized processors. In one embodiment, each of the specialized processors controls a respective one associated memory domain in the memory area. In an embodiment, the processor-memory system further comprises a specialized processor wafer. The specialized processor wafer includes the memory area, and the multitude of specialized processors are embedded in the specialized processor wafer.

Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration

A method of reducing heat flow between IC chips and the resulting device are provided. Embodiments include attaching plural IC chips to an upper surface of a substrate; forming a lid over the IC chips; and forming a slit through the lid at a boundary between adjacent IC chips.

Thermally enhanced package to reduce thermal interaction between dies

A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

Conductive adhesive composition

A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Conductive adhesive rework method

Solvent-free UV-curable polymer materials derived from miscible blends of reactive organic monomeric, oligomeric and low molecular polymeric systems and organic and inorganic fillers such as polytetrafluoroethylene and talc are provided to form polymer-filler composite compositions for use in the fabrication and repair of electronic components and microelectronic assembly processes. The composition contains a preformed thermoplastic or elastomeric polymer/oligomer with reactive end groups, a monofunctional and/or bifunctional acrylate monomer, a multifunctional (more than two reactive groups) acrylated/methacrylated monomer, a photoinitiator and a fluorocarbon polymer powder as an organic filler which is preferably PTFE and an inorganic filler such as talc. A nano-filler may also be used as the inorganic filler alone or in combination with another inorganic filler such as talc. A method is also provided for repairing defects on ceramic substrates using the composition of the invention or other curable polymeric compositions.

UV-curable solvent free compositions and use thereof in ceramic chip defect repair

A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Thermal interface adhesive and rework

A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.

High performance integrated MLC cooling device for high power density ICS and method for manufacturing

A method and apparatus are provided for reworking of finishing metallurgy on pads of electronic components. The pads are copper or copper/nickel and have a layer of nickel thereon and an overlying layer of gold. The gold layer is removed first followed by the nickel layer and then the component is treated to remove etch and corrosion products. Media blasting is then used to restore the pads to their original condition as on prime parts. The pads are then replated using conventional nickel and gold plating solutions to form the reworked component.

Rework method for finishing metallurgy on chip carriers

A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/&deg;C. at 100&deg; C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.

Polymer and ceramic composite electronic substrates

A self scrubbing buckling beam contactor for contacting an array of pads positioned on a device under test is described. The contactor consists of three insulating dies: a top, an offset and a lower die separated from each other by an insulated spacer of variable thickness. Each die is provided with holes. The buckling beam has an array of flexible wires positioned substantially perpendicular to the dies, each of the flexible wires crossing a corresponding hole in each of the top, offset and lower dies to allow each wire respectively contact a pad of the device under test. By shifting the center of the hole of the lower die relative to the center of the offset die, the tip of the wire exits from the lower die at an angle with respect to the plane formed by the pads of the device under test. The exit angle of the wire tip is controlled by the relative displacement of the offset die relative to the bottom die, such that the exit angle of the tip of the wire at the bottom die changes when the probe wire is under compression. By applying a reciprocating motion to the tip of the wire contacting the surface of the device under test, a scrubbing motion is achieved that lowers the resistance between the pad of the device under test. In this manner, the tip of the wire cleans the surface of the pads and prevents contaminants from adhering to the tip of the wire.

Self-scrub buckling beam probe

A method of forming interconnects on an electronic device that can be bonded to another electronic device at a low processing temperature can be carried out by depositing a first interconnect material on the electronic device forming protrusions and then depositing a second interconnect material to at least partially cover the protrusions, wherein the second interconnect material has a lower flow temperature than the first interconnect material. The method is carried out by flowing a molten solder into a mold having microcavities to fill the cavities and then allowed to solidify. The mold is then aligned with a silicon wafer containing chips deposited with high melting temperatures solder bumps such that each microcavity of the mold is aligned with each high melting temperature solder bump on the chip. The aligned mold/wafer assembly is then passed through a reflow furnace to effect the transfer of the low melting temperature solder in the mold cavities onto the tip of the high melting temperature solder bumps on the wafer. A dual metallurgical composition bump is thereby formed by the two different solder alloys.

Method for making interconnect for low temperature chip attachment

Growing community of inventors

New Paltz, NY, United States of America

Daniel George Berger