The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Jul. 23, 2020
Micron Technology, Inc., Boise, ID (US);
Steven K. Groothuis, Boise, ID (US);
Jian Li, Boise, ID (US);
Haojun Zhang, Clay, NY (US);
Paul A. Silvestri, Chandler, AZ (US);
Xiao Li, Boise, ID (US);
Shijian Luo, Boise, ID (US);
Luke G. England, Urbandale, IA (US);
Brent Keeth, Boise, ID (US);
Jaspreet S. Gandhi, San Jose, CA (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies.