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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10741460 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

Oct. 16, 2018

Methods for forming interconnect assemblies with probed bond pads

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Owen R. Fay, Meridian, ID (US);

Kyle K. Kirby, Eagle, ID (US);

Luke G. England, Saratoga Springs, NY (US);

Jaspreet S. Gandhi, San Jose, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Perkins Coie LLP

Primary Examiner:

William F Kraig

Assistant Examiner:

Vicki B Booker

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 22/14 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H05K 999/99 (2013.01); H01L 2224/02163 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/0392 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1461 (2013.01);
Abstract

An interconnect assembly includes a bond pad and an interconnect structure configured to electrically couple an electronic structure to the bond pad. The interconnect structure physically contacts areas of the bond pad that are located outside of a probe contact area that may have been damaged during testing. Insulating material covers the probe contact area and defines openings spaced apart from the probe contact area. The interconnect structure extends through the openings to contact the bond pad.

Find Patent Forward Citations

Fay, Owen. (2020). Methods for forming interconnect assemblies with probed bond pads (U.S. Patent No. 10741460). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10741460

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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