Boise, ID, United States of America

Kyle K Kirby

USPTO Granted Patents = 210 

 

Average Co-Inventor Count = 2.1

ph-index = 25

Forward Citations = 2,920(Granted Patents)

Forward Citations (Not Self Cited) = 2,634(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Boise, ID (US) (2001 - 2023)
  • Eagle, ID (US) (2008 - 2024)

Company Filing History:


Years Active: 2001-2025

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Areas of Expertise:
Semiconductor Interconnects
Microelectronic Devices
Hybrid Bonding
Through-Substrate Interconnects
Thermal Enhancement
Pillar Array Packaging
Memory Stacks
Piezoelectric Materials
Wafer Handling
3D Interconnects
Inductors
Stress Resistance
210 patents (USPTO):Explore Patents

Title: Kyle K Kirby: Innovator Extraordinaire in Microelectronics

Introduction:

In the rapidly evolving field of microelectronics, one name that stands out is that of Kyle K Kirby. Hailing from Boise, ID in the United States, Kirby has made significant contributions to the industry with his extensive patent portfolio and innovative inventions. This article delves into Kirby's latest patents, highlights his career achievements, explores his collaborations, and underscores his impact on the world of microelectronics.

Latest Patents:

Among Kyle K Kirby's recent patents, two notable inventions have garnered attention. The first patent involves apparatuses exhibiting enhanced stress resistance and planarity, which are crucial factors in microelectronic device manufacturing. These apparatuses feature conductive segments with an uneven topography and a unique arrangement of passivation materials, ensuring a substantially flat surface above the conductive segments. This invention greatly improves the stability and reliability of microelectronic devices and memory devices.

In his second patent, Kirby presents an innovative solution for semiconductor die stacks and associated systems. By bonding a first die containing a memory array with a second die housing CMOS circuitry, Kirby enables an efficient and compact integration of memory devices. The unique placement of bond pads on the second die allows for easy connection without interfering with other stacked dies. This invention opens up possibilities for even greater memory capacity and performance in microelectronics.

Career Highlights:

Throughout his career, Kirby has made significant contributions to the microelectronics industry. Notably, he has been associated with renowned companies such as Micron Technology Incorporated and Aptina Imaging Corporation. As a key figure in these organizations, Kirby has played a pivotal role in developing cutting-edge technologies, pushing the boundaries of microelectronics, and driving innovation forward.

Collaborations:

Collaboration has always been central to Kirby's work, and he has had the opportunity to work alongside exceptional professionals in the field. Two notable coworkers who have been part of Kirby's journey are Warren M Farnworth and William Mark Hiatt. These collaborations have fostered an environment of sharing knowledge, ideas, and expertise, leading to groundbreaking advancements in microelectronics.

Conclusion:

In the world of microelectronics, Kyle K Kirby has proven himself to be an invaluable innovator. With a remarkable patent count of 186 and a portfolio filled with forward-thinking inventions, Kirby consistently pushes the limits of what is possible in microelectronic devices and memory devices. His career highlights at Micron Technology Incorporated and Aptina Imaging Corporation exemplify his dedication to advancing the field. Through fruitful collaborations with industry peers like Warren M Farnworth and William Mark Hiatt, Kirby reinforces the importance of teamwork in driving innovation and patentable inventions. As microelectronics continue to shape our world, Kyle K Kirby remains at the forefront of cutting-edge advances, revolutionizing the industry one patent at a time.

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