The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2019

Filed:

Aug. 24, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Luke England, Saratoga Springs, NY (US);

Tanya Atanasova, Saratoga Springs, NY (US);

Daniel Smith, Ballston Spa, NY (US);

Daniel Fisher, Clifton Park, NY (US);

Sukeshwar Kannan, Malta, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/60 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/60 (2013.01); H01L 23/5226 (2013.01); H01L 24/35 (2013.01); H01L 2223/54493 (2013.01); H01L 2223/6616 (2013.01);
Abstract

One method includes positioning a front side of a first substrate opposite a side of a second substrate, the first substrate comprising an ESD mitigation structure located at an approximate center of the front side, the second substrate comprising at least one TSV structure that extends through the side of the second substrate, the first substrate and the second substrates adapted to be positioned so as to result in the conductive coupling of the at least one TSV structure and the ESD mitigation structure, bending the first substrate to an initial contact position such that an initial engagement between the first substrate and the second substrate will result in conductively coupling between the ESD mitigation structure and the TSV structure, and engaging the first and second substrates with one another such that the ESD mitigation structure and the TSV structure are conductively coupled to one another.


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