Leena Paivikki Buchwalter

USPTO Granted Patents = 21 (Patent Applications = 2)

Average Co-Inventor Count = 6.9

ph-index = 9

Forward Citations = 521(Granted Patents)

Location History:

Wappingers Falls, NY (US) (1992 - 1994)
Hopewell Junction, NY (US) (2001 - 2012)

Company Filing History:

19 out of 164,197

International Business Machines Corporation

Telefonaktiebolaget Lm Ericsson (publ)

patents

Years Active: 1992-2012

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21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8314500 - Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers (2012-11-20),

2. 8269291 - Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters (2012-09-18),

3. 8187923 - Laser release process for very thin Si-carrier build (2012-05-29),

4. 7943412 - Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters (2011-05-17),

5. 7932169 - Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers (2011-04-26),

6. 7815968 - Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation (2010-10-19),

7. 7615405 - Method for precision assembly of integrated circuit chip packages (2009-11-10),

8. 7456046 - Method to create flexible connections for integrated circuits (2008-11-25),

9. 7452568 - Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation (2008-11-18),

10. 7282391 - Method for precision assembly of integrated circuit chip packages (2007-10-16),

11. 7276787 - Silicon chip carrier with conductive through-vias and method for fabricating same (2007-10-02),

12. 7199450 - Materials and method to seal vias in silicon substrates (2007-04-03),

13. 7019402 - Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor (2006-03-28),

14. 6818843 - Microswitch with a micro-electromechanical system (2004-11-16),

15. 6593660 - Plasma treatment to enhance inorganic dielectric adhesion to copper (2003-07-15),

Title: The Innovations of Leena Paivikki Buchwalter

Introduction: Leena Paivikki Buchwalter, a pioneering female inventor based in Hopewell Junction, NY, has made significant contributions to the field of microelectronics with a total of 21 patents to her name.

Latest Patents: Among her latest patents is an ingenious interconnection structure for flip-chip attachment of microelectronic device chips, designed to improve reaction barrier layers. Additionally, she innovated a low-temperature Bi-CMOS compatible process for MEMS RF resonators and filters, showcasing her expertise in diverse technological areas.

Career Highlights: Buchwalter has worked with prestigious companies such as IBM (International Business Machines Corporation) and Ultratech, Inc., where she honed her skills and brought her groundbreaking ideas to life.

Collaborations: Throughout her career, Leena Paivikki Buchwalter has collaborated with talented individuals like Stephen L Buchwalter and John Patrick Hummel, fostering a culture of innovation and teamwork in her endeavors.

Conclusion: Leena Paivikki Buchwalter's relentless pursuit of innovation and her remarkable portfolio of patents underscore her status as a trailblazer in the field of microelectronics, inspiring future generations of inventors to push the boundaries of technological advancement.

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