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For the Inventor, By the Inventor

Hopewell Junction, NY, United States of America

Leena Paivikki Buchwalter

This inventor holds 21 USPTO granted patents and 2 published patent applications, primarily in Integrated Circuit Packaging. Top assignees: International Business Machines Corporation, Telefonaktiebolaget Lm Ericsson (Publ), Ultratech, Inc.. Active years: 1992-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Leena Paivikki Buchwalter. Retrieved from https://idiyas.com/inventor/leena-paivikki-buchwalter

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 57.1

Average Co-Inventor Count = 6.9

ph-index = 9

Forward Citations = 525(Granted Patents)


Location History:

  • Wappingers Falls, NY (US) (1992 - 1994)
  • Hopewell Junction, NY (US) (2001 - 2012)

Company Filing History:

goldMedal19 out of 166,425 
 
International Business Machines Corporation
 patents
silverMedal1 out of 27,071 
 
Telefonaktiebolaget Lm Ericsson (Publ)
 patents
bronzeMedal1 out of 138 
 
Ultratech, Inc.
 patents

Years Active: 1992-2012

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Areas of Expertise:
Flip-Chip Interconnections
Lead-Free Solders
MEMS RF Resonators
Precision Assembly
Micro Vias
Integrated Circuits
Silicon Chip Carrier
Dielectric Adhesion
Centrifugal Method
Laser Assisted Deposition
Polyimide Modification
Micro-Electromechanical Systems
21 patents (USPTO):Explore Patents
1. 8314500 - Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers (2012-11-20),
2. 8269291 - Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters (2012-09-18),
3. 8187923 - Laser release process for very thin Si-carrier build (2012-05-29),
4. 7943412 - Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters (2011-05-17),
5. 7932169 - Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers (2011-04-26),
6. 7815968 - Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation (2010-10-19),
7. 7615405 - Method for precision assembly of integrated circuit chip packages (2009-11-10),
8. 7456046 - Method to create flexible connections for integrated circuits (2008-11-25),
9. 7452568 - Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation (2008-11-18),
10. 7282391 - Method for precision assembly of integrated circuit chip packages (2007-10-16),
11. 7276787 - Silicon chip carrier with conductive through-vias and method for fabricating same (2007-10-02),
12. 7199450 - Materials and method to seal vias in silicon substrates (2007-04-03),
13. 7019402 - Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor (2006-03-28),
14. 6818843 - Microswitch with a micro-electromechanical system (2004-11-16),
15. 6593660 - Plasma treatment to enhance inorganic dielectric adhesion to copper (2003-07-15),

Title: The Innovations of Leena Paivikki Buchwalter

Introduction: Leena Paivikki Buchwalter, a pioneering female inventor based in Hopewell Junction, NY, has made significant contributions to the field of microelectronics with a total of 21 patents to her name.

Latest Patents: Among her latest patents is an ingenious interconnection structure for flip-chip attachment of microelectronic device chips, designed to improve reaction barrier layers. Additionally, she innovated a low-temperature Bi-CMOS compatible process for MEMS RF resonators and filters, showcasing her expertise in diverse technological areas.

Career Highlights: Buchwalter has worked with prestigious companies such as IBM (International Business Machines Corporation) and Ultratech, Inc., where she honed her skills and brought her groundbreaking ideas to life.

Collaborations: Throughout her career, Leena Paivikki Buchwalter has collaborated with talented individuals like Stephen L Buchwalter and John Patrick Hummel, fostering a culture of innovation and teamwork in her endeavors.

Conclusion: Leena Paivikki Buchwalter's relentless pursuit of innovation and her remarkable portfolio of patents underscore her status as a trailblazer in the field of microelectronics, inspiring future generations of inventors to push the boundaries of technological advancement.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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