The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8187923 B1

PDF
Full Text
Expired
Date of Patent:
May. 29, 2012

Filed:

Jul. 03, 2008
Applicants:

Paul Stephen Andry, Yorktown Heights, NY (US);

Leena Paivikki Buchwalter, Hopewell Junction, NY (US);

Matthew J. Farinelli, Riverdale, NY (US);

Sherif A. Goma, White Plains, NY (US);

Raymond R. Horton, Dover Plains, NY (US);

Edmund J. Sprogis, Underhill, VT (US);

Inventors:

Paul Stephen Andry, Yorktown Heights, NY (US);

Leena Paivikki Buchwalter, Hopewell Junction, NY (US);

Matthew J. Farinelli, Riverdale, NY (US);

Sherif A. Goma, White Plains, NY (US);

Raymond R. Horton, Dover Plains, NY (US);

Edmund J. Sprogis, Underhill, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.


Find Patent Forward Citations

Andry, Paul. (2012). Laser release process for very thin si-carrier build (U.S. Patent No. 8187923). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8187923

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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