Dover Plains, NY, United States of America

Raymond R Horton

This inventor holds 46 USPTO granted patents and 1 published patent application, primarily in Electronic Packaging. Top assignees: International Business Machines Corporation, Other. Active years: 1989-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Raymond R Horton. Retrieved from https://idiyas.com/inventor/raymond-r-horton

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 46 

% Patents Active = 82.6

Average Co-Inventor Count = 4.6

ph-index = 12

Forward Citations = 510(Granted Patents)


Location History:

  • Dover Plaines, NY (US) (1994)
  • Plains, NY (US) (2008 - 2010)
  • Dover Plains, NY (US) (1989 - 2023)

Company Filing History:


Years Active: 1989-2023

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Areas of Expertise:
Thin Die Stack
Decoupling Capacitance
Integrated Circuit
Thermal Interposer
Silicon Substrates
Electronic Package
Bonding Techniques
Solder Application
Conductive Through-Vias
Micro-Scale Positioning
Fluxless Solder
Elastomeric Mounting
46 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Raymond R. Horton

Introduction

Raymond R. Horton, located in Dover Plains, NY, has made significant strides in the field of technology and engineering. With an impressive total of 46 patents to his name, his contributions have greatly influenced various industries, especially in the realm of die stacking technologies.

Latest Patents

Among his latest innovations are two notable patents that showcase his expertise in developing methods for thin die stack assemblies. The first patent, "Method of Forming Thin Die Stack Assemblies," details a process where die surfaces remain flat within a 5-micron tolerance, despite their reduced thickness. This advancement is crucial in maintaining precision in electronic devices. Additionally, his patent titled "Thinned Die Stack" reiterates the same principles, ensuring that the inter-die spacing maintains a residual flux height below 50% of the spacing distance between adjacent surfaces. These innovations are pivotal in the advancement of microelectronics, allowing for finer assembly techniques in the manufacturing process.

Career Highlights

Raymond has had a fruitful career working with globally recognized companies such as International Business Machines Corporation (IBM), where he has further honed his skills and developed pioneering technologies. His experience at IBM has equipped him with the unique insights necessary for advancing tech solutions that push the envelope of what is possible in the industry.

Collaborations

Throughout his career, Raymond has collaborated with esteemed professionals such as Michael J. Palmer and Ismail C. Noyan. Their combined expertise and innovative spirit have led to breakthroughs that continue to impact the field of electronics and manufacturing. These partnerships underline the importance of teamwork and collaboration in driving technological progress.

Conclusion

Raymond R. Horton stands out as a leading inventor whose contributions to die stack technology and microelectronics are both impressive and transformative. His work exemplifies the spirit of innovation, making it clear that he will continue to influence the industry for years to come. With a strong portfolio of patents and impactful collaborations, Horton’s journey is a testament to the power of creativity and perseverance in the field of engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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