The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2008

Filed:

Nov. 03, 2003
Applicants:

Paul S. Andry, Mohegan Lake, NY (US);

Jon A. Casey, Poughkeepsie, NY (US);

Raymond R. Horton, Dover Plains, NY (US);

Chiraq S. Patel, Peekskill, NY (US);

Edmund J. Sprogis, Underhill, VT (US);

Brian R. Sundlof, Verbank, NY (US);

Inventors:

Paul S. Andry, Mohegan Lake, NY (US);

Jon A. Casey, Poughkeepsie, NY (US);

Raymond R. Horton, Dover Plains, NY (US);

Chiraq S. Patel, Peekskill, NY (US);

Edmund J. Sprogis, Underhill, VT (US);

Brian R. Sundlof, Verbank, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05C 1/00 (2006.01); B05C 3/00 (2006.01); B05C 3/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for filling vias, and in particular initially blind vias, in a wafer, and various apparatus for performing the method, comprising evacuating air from the vias; trapping at least a portion of the wafer and a paste for filling the vias between two surfaces; and pressurizing the paste to fill the vias.


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