The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Mar. 08, 2020
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
John Knickerbocker, Orange, NY (US);
Bing Dang, Chappaqua, NY (US);
Raymond Horton, Dover Plains, NY (US);
Joana Maria, New York, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 21/20 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/2007 (2013.01); H01L 21/4853 (2013.01); H01L 21/6835 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01);
Abstract
Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.