Company Filing History:
Years Active: 2021-2023
Title: The Innovative Journey of Joana Maria: A Pioneer in Thin Die Stack Technology
Introduction: Joana Maria, a remarkable inventor based in New York, NY, has made significant contributions to the field of electronic packaging with her innovative approaches to die stack assemblies. With a total of two patents to her name, she has demonstrated her expertise and creativity in tackling complex challenges within the industry.
Latest Patents: Joana's latest patents reflect her commitment to advancing technology in electronic devices. Her first patent, titled "Method of Forming Thin Die Stack Assemblies," introduces a groundbreaking process for creating die stacks with exceptionally thin dies. This invention ensures that die surfaces maintain a flatness within a 5-micron tolerance, even amid the complexities of the manufacturing process. Additionally, the residual flux height is controlled to remain below 50% of the spacing distance between adjacent structures, such as in the inter-die spacing. Her second patent, "Thinned Die Stack," further builds on these principles, showcasing methods that uphold the same high standards of flatness and spacing precision in die stack construction.
Career Highlights: Joana Maria is currently affiliated with the International Business Machines Corporation (IBM), a leading company known for its cutting-edge innovations in technology. Her work at IBM has allowed her to leverage her skills and knowledge in electronics and materials science, contributing to the company’s reputation for engineering excellence and innovative solutions.
Collaborations: Throughout her career, Joana has collaborated with talented individuals, including her colleagues John Ulrich Knickerbocker and Bing Dang. These partnerships reflect her ability to work within a team of professionals dedicated to pushing the boundaries of technology and improving electronic manufacturing processes.
Conclusion: Joana Maria stands out as an influential inventor in the realm of die stack technology. Her patents are a testament to her innovative mindset and technical prowess, positioning her as a leading figure in the industry. As she continues her work at IBM, her contributions promise to pave the way for future advancements in electronic packaging, solidifying her legacy as a visionary inventor.