The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2007
Filed:
Dec. 05, 2003
Daniel Charles Edelstein, White Plains, NY (US);
Paul Stephen Andry, Mohegan Lake, NY (US);
Leena Paivikki Buchwalter, Hopewell Junction, NY (US);
Jon Alfred Casey, Poughkeepsie, NY (US);
Sherif A. Goma, Hawthorne, NY (US);
Raymond R. Horton, Dover Plains, NY (US);
Gareth Geoffrey Hougham, Ossining, NY (US);
Michael Wayne Lane, Cortlandt Manor, NY (US);
Xiao HU Liu, Croton on Hudson, NY (US);
Chirag Suryakant Patel, Peekskill, NY (US);
Edmund Juris Sprogis, Underhill, VT (US);
Michelle Leigh Steen, Danbury, CT (US);
Brian Richard Sundlof, Beacon, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
George Frederick Walker, New York, NY (US);
Daniel Charles Edelstein, White Plains, NY (US);
Paul Stephen Andry, Mohegan Lake, NY (US);
Leena Paivikki Buchwalter, Hopewell Junction, NY (US);
Jon Alfred Casey, Poughkeepsie, NY (US);
Sherif A. Goma, Hawthorne, NY (US);
Raymond R. Horton, Dover Plains, NY (US);
Gareth Geoffrey Hougham, Ossining, NY (US);
Michael Wayne Lane, Cortlandt Manor, NY (US);
Xiao Hu Liu, Croton on Hudson, NY (US);
Chirag Suryakant Patel, Peekskill, NY (US);
Edmund Juris Sprogis, Underhill, VT (US);
Michelle Leigh Steen, Danbury, CT (US);
Brian Richard Sundlof, Beacon, NY (US);
Cornelia K. Tsang, Mohegan Lake, NY (US);
George Frederick Walker, New York, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.