The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7456046 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 25, 2008

Filed:

Feb. 23, 2005
Applicants:

Leena Paivikki Buchwalter, Hopewell Junction, NY (US);

Russell A. Budd, North Salem, NY (US);

Chirag S. Patel, Peekskill, NY (US);

Inventors:

Leena Paivikki Buchwalter, Hopewell Junction, NY (US);

Russell A. Budd, North Salem, NY (US);

Chirag S. Patel, Peekskill, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of producing flexible interconnections for integrated circuits, and, in particular, the forming of flexible or compliant interconnections preferably by a laser-assisted chemical vapor deposition process in semiconductor or glass substrate-based carriers which are employed for mounting and packaging multiple integrated circuit chips and selectively, other devices in the technology.


Find Patent Forward Citations

Buchwalter, Leena. (2008). Method to create flexible connections for integrated circuits (U.S. Patent No. 7456046). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7456046

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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