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Years Active: 1991-2020
Title: Innovations by Leathen Shi: A Pioneer in Semiconductor Technology
Introduction
Leathen Shi, a prominent inventor based in Yorktown Heights, NY, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 53 patents, Shi’s work focuses on advancing the integration and manufacturing processes of semiconductor devices.
Latest Patents
Among his latest patents, Leathen Shi has developed innovative methods for wafer level integration, emphasizing design and co-design, structural processing, equipment stress management, and thermal management. One notable patent provides a method to create a multi-layer wafer by applying a stress compensating oxide layer on two heterogeneous wafers, followed by the application of bonding oxide layers. The process includes chemical-mechanical polishing and low-temperature bonding to forge a multi-layer wafer pair, which enhances device performance and reliability.
Additionally, Shi has patented a wafer-to-wafer semiconductor device that comprises a crack-arresting film structure. This invention features a first wafer substrate with a bonding layer and a second wafer substrate with its bonding layer. The inclusion of a crack-arresting film layer on at least one substrate boosts the bonding energy at the interface, which is crucial for the durability of semiconductor devices.
Career Highlights
Leathen Shi’s impressive career includes notable stints at leading technology companies, notably IBM and Globalfoundries Inc. His work in these organizations has been instrumental in driving forward innovative solutions in semiconductor manufacturing and design.
Collaborations
Throughout his career, Leathen Shi has collaborated with esteemed colleagues like Kevin K Chan and Jack Oon Chu, contributing to groundbreaking advancements in the semiconductor industry. These collaborations highlight the collective effort in achieving significant technological progress.
Conclusion
Leathen Shi embodies the spirit of innovation in the semiconductor sector, with his numerous patents paving the way for future advancements. His commitment to improving manufacturing processes and device performance continues to inspire the next generation of inventors and engineers.
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