IDiyas

For the Inventor, By the Inventor

Santa Clara, CA, United States of America

Lakshmipriya Seshan

USPTO Granted Patents = 14 

 

Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 13(Granted Patents)


Location History:

  • Santa Clara, CA (US) (2020)
  • Sunnyvale, CA (US) (2024)

Company Filing History:

goldMedal14 out of 54,664 
 
Intel Corporation
 patents

Years Active: 2020-2025

where 'Filed Patents' based on already Granted Patents

14 patents (USPTO):
1. 12481614 - Standard interfaces for die to die (D2D) interconnect stacks (2025-11-25),
2. 12468597 - Valid signal for latency sensitive die-to-die (D2D) interconnects (2025-11-11),
3. 12405912 - Link initialization training and bring up for die-to-die interconnect (2025-09-02),
4. 12362306 - Clock-gating in die-to-die (D2D) interconnects (2025-07-15),
5. 12360934 - Parameter exchange for a die-to-die interconnect (2025-07-15),
6. 12353305 - Compliance and debug testing of a die-to-die interconnect (2025-07-08),
7. 12332826 - Die-to-die interconnect (2025-06-17),
8. 12321305 - Sideband interface for die-to-die interconnects (2025-06-03),
9. 12316343 - PHY-based retry techniques for die-to-die interfaces (2025-05-27),
10. 12298833 - Performance level control in a data processing apparatus (2025-05-13),
11. 12159840 - Scalable and interoperable PHYLESS die-to-die IO solution (2024-12-03),
12. 12117960 - Approximate data bus inversion technique for latency sensitive applications (2024-10-15),
13. 11971841 - Link layer-PHY interface adapter (2024-04-30),
14. 10686582 - Clock phase compensation apparatus and method (2020-06-16),

Title: Lakshmipriya Seshan: Innovator in Electronic Packaging Solutions

Introduction

Lakshmipriya Seshan is an esteemed inventor based in Santa Clara, CA, who has made significant contributions to the field of electronic packaging. With a total of four patents to her name, she is recognized for her innovative solutions that enhance the performance and efficiency of electronic components.

Latest Patents

Two of her latest patents include the "Scalable and interoperable PHYLESS die-to-die IO solution". This invention involves multi-die packages with interconnects that allow seamless communication between different dies. The electronic package features a package substrate with a first die over it, utilizing a specifically designed first IO bump map for efficiency.

Another notable patent is the "Approximate data bus inversion technique for latency sensitive applications". This invention outlines methods and systems that allow the efficient transmission of data by utilizing criteria-based logic to determine when to invert original data, thereby optimizing performance in latency-sensitive environments.

Career Highlights

Lakshmipriya Seshan has been contributing her skills and knowledge at Intel Corporation, a prominent leader in the semiconductor industry. Her work focuses on developing cutting-edge technologies that drive innovation in electronic devices.

Collaborations

Throughout her career, Seshan has collaborated with noteworthy coworkers including Gerald S. Pasdast and Peipei Wang. These collaborations have surely enriched her perspective and fortified her innovative endeavors.

Conclusion

In conclusion, Lakshmipriya Seshan exemplifies the spirit of innovation within the technology sector. Her contributions through her patents and collaborations reflect her commitment to pushing the boundaries of what is possible in electronic packaging solutions. As she continues to innovate, her work will undoubtedly leave a lasting impact on the industry.

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