The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2024
Filed:
Jun. 23, 2020
Intel Corporation, Santa Clara, CA (US);
Zhiguo Qian, Chandler, AZ (US);
Gerald Pasdast, San Jose, CA (US);
Juan Zeng, San Jose, CA (US);
Peipei Wang, San Jose, CA (US);
Ahmad Siddiqui, Sunnyvale, CA (US);
Lakshmipriya Seshan, Sunnyvale, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments disclosed herein include multi-die packages with interconnects between the dies. In an embodiment, an electronic package comprises a package substrate, and a first die over the package substrate. In an embodiment, the first die comprises a first IO bump map, where bumps of the first IO bump map have a first pitch. In an embodiment, the electronic package further comprises a second die over the package substrate. In an embodiment, the second die comprises a second IO bump map, where bumps of the second IO bump map have a second pitch that is different than the first pitch. In an embodiment, the electronic package further comprises interconnects between the first IO bump map and the second IO bump map.