Juan Zeng

Title: Innovations of Juan Zeng in Electronic Packaging

Introduction

Juan Zeng is an accomplished inventor based in San Jose, CA. He is known for his contributions to the field of electronic packaging, particularly in the development of scalable and interoperable solutions. His innovative work has led to the filing of a patent that showcases his expertise and creativity in this area.

Latest Patents

Juan Zeng holds a patent for a "Scalable and interoperable PHYLESS die-to-die IO solution." This patent includes embodiments that describe multi-die packages with interconnects between the dies. The electronic package comprises a package substrate, with a first die positioned over it. The first die features a first IO bump map, where the bumps have a specific pitch. Additionally, the package includes a second die with a different IO bump map pitch, allowing for enhanced functionality and performance.

Career Highlights

Juan Zeng is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing. His work at Intel has allowed him to push the boundaries of electronic packaging technology. With a focus on creating efficient and scalable solutions, Zeng has made significant contributions to the industry.

Collaborations

Juan has collaborated with notable colleagues, including Zhiguo Qian and Gerald S Pasdast. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Juan Zeng's work in electronic packaging exemplifies the spirit of innovation and collaboration in the technology sector. His patent and contributions at Intel Corporation highlight his role as a key player in advancing electronic solutions.