The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Jun. 20, 2022
Intel Corporation, Santa Clara, CA (US);
Debendra Das Sharma, Saratoga, CA (US);
Swadesh Choudhary, Mountain View, CA (US);
Narasimha Lanka, Dublin, CA (US);
Zuoguo Wu, San Jose, CA (US);
Gerald Pasdast, San Jose, CA (US);
Lakshmipriya Seshan, Sunnyvale, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In one embodiment, a first die comprises: a first die-to-die adapter to communicate with first protocol layer circuitry via a flit-aware die-to-die interface (FDI) and first physical layer circuitry via a raw die-to-die interface (RDI), where the first die-to-die adapter is to receive message information comprising first information of a first interconnect protocol; and the first physical layer circuitry coupled to the first die-to-die adapter. The first physical layer circuitry may be configured to receive and output the first information to a second die via an interconnect, the first physical layer circuitry comprising a plurality of modules, each of the plurality of modules comprising an analog front end having transmitter circuitry and receiver circuitry. Other embodiments are described and claimed.