The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2025
Filed:
Apr. 29, 2022
Intel Corporation, Santa Clara, CA (US);
Narasimha Lanka, Dublin, CA (US);
Debendra Das Sharma, Saratoga, CA (US);
Lakshmipriya Seshan, Sunnyvale, CA (US);
Swadesh Choudhary, Mountain View, CA (US);
Zuoguo Wu, San Jose, CA (US);
Gerald Pasdast, San Jose, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments herein relate to a die of a multi-die package, wherein the die is coupled with another die via a die-to-die (D2D) interconnect link. The die may transmit a data signal to the other die via a data lane of the D2D interconnect link. The die may further transmit, concurrently with the data signal, a valid signal to the other die via a valid lane of the D2D interconnect link. The valid signal may change logical state at least once during the transmission of the data signal. Other embodiments may be described and claimed.