Kung-Wei Lee

This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kung-Wei Lee. Retrieved from https://idiyas.com/inventor/kung-wei-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 8(Granted Patents)

Location History:

New Taipei, TW (2017 - 2021)
Hsinchu, TW (2023)

Company Filing History:

6 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2017-2025

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12507472 - Method of making polysilicon structure including protective layer (2025-12-23),

2. 11855086 - Polysilicon structure including protective layer (2023-12-26),

3. 10957697 - Polysilicon structure including protective layer (2021-03-23),

4. 10050035 - Method of making protective layer over polysilicon structure (2018-08-14),

5. 10014207 - Method of manufacturing dielectric layers of semiconductor structure (2018-07-03),

6. 9589969 - Semiconductor device and manufacturing method of the same (2017-03-07),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: