Kung-Wei Lee

Title: Kung-Wei Lee and Semiconductor Process Innovation.

Introduction

Kung-Wei Lee is an inventor based in Taipei, Taiwan. His patent work focuses on semiconductor structures and manufacturing processes, including techniques for protecting polysilicon features during device fabrication. He is associated with Taiwan Semiconductor Manufacturing Company Limited and has 6 patents.

Latest Patents

Lee’s latest listed patents address protective layers for polysilicon structures.

“Method of Making Polysilicon Structure Including Protective Layer” describes a process for forming a polysilicon structure and a sidewall spacer with a concave corner region, then covering them with a protective layer. The method aims to keep the layer’s thickness over the concave corner close to its thickness over the polysilicon structure, with a difference of no more than 10 percent.

“Polysilicon Structure Including Protective Layer” describes a semiconductor device with two polysilicon structures and their respective sidewall spacers. Its protective layer covers the first spacer and polysilicon structure while maintaining the specified thickness uniformity and exposing the topmost portion of the second spacer’s sidewall.

Career Highlights

Lee’s listed patent portfolio reflects work on semiconductor device structures and fabrication methods. The described inventions focus on protective-layer coverage and spacer geometry, details that can matter in manufacturing processes.

Collaborations

Lee’s listed coworkers include Chui-Ya Peng and Yu-Shao Cheng. His company affiliation is Taiwan Semiconductor Manufacturing Company Limited.

Conclusion

Kung-Wei Lee’s patent work centers on protective layers for polysilicon structures, with an emphasis on coverage and thickness control in semiconductor fabrication.