Taiwan Semiconductor Manufacturing Comp. Ltd.

Kung-Wei Lee

Chui-Ya Peng

Shin-Yeu Tsai

Yu-Shao Cheng

Yu-Wei Chang

Jia-You Tsai

Austin Hsu

A method of making a semiconductor device includes forming a first polysilicon structure over a first portion of a substrate. The method further includes forming a first spacer on a sidewall of the first polysilicon structure, wherein the first spacer has a concave corner region between an upper portion and a lower portion. The method further includes forming a protective layer covering an entirety of the first spacer and the first polysilicon structure, wherein the protective layer has a first thickness over the concave corner region and a second thickness over the first polysilicon structure, and a difference between the first thickness and the second thickness is at most 10% of the second thickness.

Method of making polysilicon structure including protective layer

A semiconductor device includes a substrate, a first polysilicon structure over a first portion of the substrate, and a first spacer on a sidewall of the first polysilicon structure. The first spacer has a concave corner region between an upper portion and a lower portion. The semiconductor device includes a second polysilicon structure over a second portion of the substrate. The semiconductor device includes a second spacer on a sidewall of the second polysilicon structure. The semiconductor device further includes a protective layer covering an entirety of the first spacer and the first polysilicon structure, wherein the protective layer has a first thickness over the concave corner region and a second thickness over the first polysilicon structure, a difference between the first thickness and the second thickness is at most 10% of the second thickness, and the protective layer exposes a top-most portion of a sidewall of the second spacer.

Polysilicon structure including protective layer

A manufacture includes a substrate comprising a first portion and a second portion. The manufacture further includes a first polysilicon structure over the first portion of the substrate. The manufacture further includes a second polysilicon structure over the second portion of the substrate. The manufacture further includes two spacers on opposite sidewalls of the second polysilicon structure, wherein each spacer of the two spacers has a concave corner region between an upper portion and a lower portion. The manufacture further includes a protective layer covering the first portion of the substrate and the first polysilicon structure, the protective layer exposing the second portion of the substrate, the second polysilicon structure, and partially exposing the two spacers.

A method includes forming a first polysilicon structure over a first portion of a substrate. A second polysilicon structure is formed over a second portion of the substrate. Two spacers are formed on opposite sidewalls of the second polysilicon structure. A layer of protective material is formed to cover the first and second portions of the substrate. The layer of protective material has a first thickness over the second polysilicon structure and a second thickness over the two spacers. The first thickness is equal to or greater than 500 &#x212b;, and the second thickness is equal to or less than 110% of the first thickness. A patterned photo resist layer is formed to cover a first portion of the layer of protective material that covers the first portion of the substrate. The second portion of the layer of protective material is removed.

Method of making protective layer over polysilicon structure

A method of filling a dielectric trench includes forming two adjacent conductors on a substrate, forming a dielectric layer over a surface of the conductors and the substrate, removing a portion of the dielectric layer, treating a top surface of the dielectric layer with phosphorous plasma, and repeating the forming the dielectric layer, the removing the portion of the dielectric layer, and the treating the top surface of the dielectric layer in a multi cycle fashion. A narrowest width of the dielectric trench between the two adjacent conductors is smaller than about 30 nm.

Method of manufacturing dielectric layers of semiconductor structure

Semiconductor devices and manufacturing methods of the same are disclosed. The semiconductor device includes a die, a conductive structure, a bonding pad and a passivation layer. The conductive structure is over and electrically connected to the die. The bonding pad is over and electrically connected to the conductive structure. The passivation layer is over the bonding pad, wherein the passivation layer includes a nitride-based layer with a refractive index of about 2.16 to 2.18.

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Taipei, Taiwan

Kung-Wei Lee