The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Jul. 30, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Jia-You Tsai, Taipei, TW;

Kung-Wei Lee, New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 21/3115 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76224 (2013.01); H01L 21/0234 (2013.01); H01L 21/02129 (2013.01); H01L 21/02131 (2013.01); H01L 21/02252 (2013.01); H01L 21/02266 (2013.01); H01L 21/02274 (2013.01); H01L 21/02321 (2013.01); H01L 21/3065 (2013.01); H01L 21/31155 (2013.01); H01L 21/76826 (2013.01); H01L 21/76837 (2013.01); H01L 23/5329 (2013.01); H01L 23/53295 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method of filling a dielectric trench includes forming two adjacent conductors on a substrate, forming a dielectric layer over a surface of the conductors and the substrate, removing a portion of the dielectric layer, treating a top surface of the dielectric layer with phosphorous plasma, and repeating the forming the dielectric layer, the removing the portion of the dielectric layer, and the treating the top surface of the dielectric layer in a multi cycle fashion. A narrowest width of the dielectric trench between the two adjacent conductors is smaller than about 30 nm.


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