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For the Inventor, By the Inventor

Fujisawa, Japan

Kosuke Inoue

This inventor holds 19 USPTO granted patents and 1 EPO patent. Top assignees: Hitachi, Ltd., Renesas Technology Corp., Hitachi Tokyo Electronics Co., Ltd.. Active years: 2000-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kosuke Inoue. Retrieved from https://idiyas.com/inventor/kosuke-inoue-nm6yzsz8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19

% Patents Active = 68.4


Average Co-Inventor Count = 5.7

ph-index = 10

Forward Citations = 306(Granted Patents)


Location History:

  • Yokohama, JP (2000 - 2002)
  • Fujisawa, JP (2001 - 2008)

Company Filing History:

goldMedal14 out of 42,731 
 
Hitachi, Ltd.
 patents
silverMedal3 out of 3,781 
 
Renesas Technology Corp.
 patents
bronzeMedal1 out of 21 
 
Hitachi Tokyo Electronics Co., Ltd.
 patents
4. 1 out of 336 
 
Hitachi Ulsi Systems Co., Ltd.
 patents
5. 2 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 2000-2008

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19 patents (USPTO):Explore Patents
1. 7413130 - Paper tag identified by using radiofrequency and method of manufacturing the same (2008-08-19),
2. 7190072 - RFID-chip having RFID-tag or magnifying electrode (2007-03-13),
3. 7185823 - Paper tag identified by using radiofrequency and method of manufacturing the same (2007-03-06),
4. 7122087 - Method of manufacturing RFID (2006-10-17),
5. 7057283 - Semiconductor device and method for producing the same (2006-06-06),
6. 6930388 - Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure (2005-08-16),
7. 6869008 - Method of forming bumps (2005-03-22),
8. 6822317 - Semiconductor apparatus including insulating layer having a protrusive portion (2004-11-23),
9. 6770547 - Method for producing a semiconductor device (2004-08-03),
10. 6695200 - Method of producing electronic part with bumps and method of producing electronic part (2004-02-24),
11. 6624504 - Semiconductor device and method for manufacturing the same (2003-09-23),
12. 6595404 - Method of producing electronic part with bumps and method of producing electronic part (2003-07-22),
13. 6471115 - Process for manufacturing electronic circuit devices (2002-10-29),
14. 6460755 - Bump forming method and apparatus therefor (2002-10-08),
15. 6413850 - Method of forming bumps (2002-07-02),

Title: Kosuke Inoue: Pioneering Inventor from Fujisawa

Introduction: Kosuke Inoue is a renowned inventor hailing from Fujisawa, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kosuke Inoue holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous dedication to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Kosuke Inoue has worked with leading tech companies and research institutions, playing a pivotal role in the development of cutting-edge solutions that have revolutionized various industries.

Collaborations: Throughout his career, Kosuke Inoue has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and knowledge exchange that has led to the creation of impactful inventions.

Conclusion: Kosuke Inoue's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his position as a trailblazer in the world of technology, inspiring future generations of inventors to dream big and push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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