The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2002
Filed:
Mar. 07, 1997
Kosuke Inoue, Yokohama, JP;
Takamichi Suzuki, Yokohama, JP;
Hitoshi Odashima, Yokohama, JP;
Katsuhiro Iwashita, Yokohama, JP;
Tatsuya Yoneda, Kodaira, JP;
Michiharu Honda, Yokohama, JP;
Katuhisa Tanaka, Ayase, JP;
Tsuyoshi Yamaguchi, Hadano, JP;
Tetsuo Murakami, Atsugi, JP;
Asahi Tsuchiya, Atsugi, JP;
Yoshitatsu Naito, Ebina, JP;
Mitsuhiro Suzuki, Zama, JP;
Izumi Hata, Odawara, JP;
Kouji Sajiki, Ebina, JP;
Other;
Abstract
There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.