Katsuhiro Iwashita

Title: Katsuhiro Iwashita: Innovator in Solder Bump Technology

Introduction

Katsuhiro Iwashita is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of electronics, particularly in solder bump technology. With a total of 3 patents to his name, Iwashita's work has enhanced the reliability and efficiency of electronic components.

Latest Patents

One of Iwashita's latest patents is a solder bump forming method and apparatus. This innovation achieves high reliability in the production of electronic parts. The method includes steps for arraying solder balls, supplying flux, and mounting solder balls on a board. Each step is monitored to ensure that no solder ball is omitted, thereby enhancing the reliability of the process and preventing defective products.

Another significant patent is a continuous sputtering apparatus. This apparatus features a main vacuum chamber, a loading station, and multiple process stations with individually controlled pressures. The design includes a sub vacuum chamber that communicates with the main vacuum chamber, allowing for efficient processing of substrates.

Career Highlights

Throughout his career, Katsuhiro Iwashita has worked with prominent companies, including Hitachi, Ltd. His experience in these organizations has contributed to his expertise in the field of electronics and patent development.

Collaborations

Iwashita has collaborated with notable coworkers such as Susumu Aiuchi and Kosuke Inoue. Their collective efforts have further advanced the innovations in solder bump technology and related fields.

Conclusion

Katsuhiro Iwashita's contributions to the field of electronics through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the reliability of electronic components, showcasing the importance of innovation in technology.