Hitachi, Ltd.

Other

Katsuhiro Iwashita

Susumu Aiuchi

Hiroshi Nakamura

Mitsuhiro Suzuki

Mineo Nomoto

Toru Otsubo

Kosuke Inoue

Takamichi Suzuki

Michiharu Honda

Hitoshi Odashima

Yoshitatsu Naito

Tamotsu Shimizu

Hideki Tateishi

Tsuyoshi Yamaguchi

Tatsuya Yoneda

Tetsuo Murakami

Katuhisa Tanaka

Asahi Tsuchiya

Kouji Sajiki

Izumi Hata

There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

Bump forming method and apparatus therefor

A continuous sputtering apparatus comprising a main vacuum chamber, one loading station and a plurality of process stations capable of having their pressures controlled separately. The process station includes a sub vacuum chamber capable of being in communication with the main vacuum chamber through an opening and an evacuation port. The loading station and the process stations are arranged to be spaced with equal angles. Substrate holders are provided to face the stations and are rotated by said equal angle in a time. The substrate holder opens and closes the opening of the sub vacuum chamber to serve as a gate valve.

Continuous sputtering apparatus

A projecting apparatus for forming an image of a mask on a wafer by a projector of a unit magnification reflection system having a concave spherical mirror and a convex spherical mirror. The distance from the projector to the mask or the upper side of a mask holder for holding the mask and the distance from the projector to the wafer are measured. An error of the image-forming position is computed from the distance measurements. At least one of the mask, the wafer and the projector is moved along the direction of projection in a manner to eliminate the error of the image-forming position computed, thus attaining automatic focus adjustment.

Projecting apparatus

Growing community of inventors

Yokohama, Japan

Katsuhiro Iwashita