The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2002
Filed:
Aug. 18, 2000
Noriyuki Ooroku, Yokohama, JP;
Kosuke Inoue, Fujisawa, JP;
Takamichi Suzuki, Yokohama, JP;
Asao Nishimura, Kokubunji, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention provides a method of forming bumps capable of forming many bumps having an adequate volume and having a narrow range of variations in height and few limitations in selecting materials on an object such as a semiconductor device or the like at high production rates with high reliability and with ease, and a system therefor. The present invention uses a suction head using a porous plate and a stencil having many apertures. Solder balls are previously aligned and charged into the stencil. The solder balls and the stencil are sucked and retained by the suction head and then are positioned with respect to the surfaces of the pads of a semiconductor device and only the solder balls are dropped on the pads. The solder balls are fixed to the pads with an adhesive previously applied thereto and then are reflowed to form bumps.